Winmax XC7 dump file ufi box 100% tested file
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8243
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G2d (0x483847326404), rev: 0x05, serial number: 0x03A2A135
Manufacturing date: Feb 2015
CID: 90014A48 38473264 040503A2 A13522DA
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 512 KiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6582, cpu abi: armeabi-v7a
manufacturer: Winmax
board: Winmax_XC7, name: Winmax_XC7
brand: Winmax, model: XC7
build model list: XC7
build id: KOT49H, version: 4.4.2 Lollipop (Winmax_XC7_V5.1_20150330)
build description: Winmax_XC7-user 4.4.2 KOT49H eng.jenkins.1427688428 dev-keys
Selected: [HYNIX] eNAND H9TQ65A8GTMCUR-KTM/8GB+LPDDR3 8Gb (BGA221)
OK
updating file: app/images/phone/Xiaomi/edl_tp/virgo,virgo_lte,leo.jpg (92.85 KiB)... OK
updating file: app/mediatek.Meizu.def (6.88 MiB)...
Interface: UFI High-Speed
Serial number: 0011-8840-8243
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G2d (0x483847326404), rev: 0x05, serial number: 0x03A2A135
Manufacturing date: Feb 2015
CID: 90014A48 38473264 040503A2 A13522DA
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 512 KiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6582, cpu abi: armeabi-v7a
manufacturer: Winmax
board: Winmax_XC7, name: Winmax_XC7
brand: Winmax, model: XC7
build model list: XC7
build id: KOT49H, version: 4.4.2 Lollipop (Winmax_XC7_V5.1_20150330)
build description: Winmax_XC7-user 4.4.2 KOT49H eng.jenkins.1427688428 dev-keys
Selected: [HYNIX] eNAND H9TQ65A8GTMCUR-KTM/8GB+LPDDR3 8Gb (BGA221)
OK
updating file: app/images/phone/Xiaomi/edl_tp/virgo,virgo_lte,leo.jpg (92.85 KiB)... OK
updating file: app/mediatek.Meizu.def (6.88 MiB)...
01712-292032
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